AP1066 is a Power Amplifier Module for dual mode AMPS/CDMA cellular handset applications. The MMIC is fabricated using an advanced InGaP HBT technology and offers high power, high linearity, high efficiency, stable and reliable performance. It is packaged in a 10-pin surface mount module and self-contained with input and output matching networks optimized for 50 system to minimize the use of external components.