AP1069 is a Power Amplifier Module for TDMA applications. The MMIC is fabricated using advanced InGaP HBT technology and offers high power, high linearity, high efficiency, stable and reliable performance. It is packaged in a 10-pin industry compatible 4mm x 4mm Land Grid Array (LGA) surface mount module and self-contained with input and output matching networks optimized for 50 W system to minimize the use of external components .